Wingo - Automatic Epoxy Resin Mounting Device

Specimen Mounting Devices - Automatic Epoxy Resin Mounting Device Model RAM-1

Sample deflexion during grinding/polishing can be prevented by mounting the sample in resin. Through this process the specimen are easier to hold with the fingers during manual grinding/polishing. The stable grinding/polishing conditions can be performed by setting the specimen in a holder for automatic grinding/polishing.

Wingo's Hot Mounting is extremely advantageous, especially with small and irregularly shaped materials, and it enables excellent specimen surfaces to be obtained. A material can be mounted in resin in a short time by hydraulic pressing and heating by a temperature-controlled heater in the Handy press, Semi-automatic press or Motorized press model.

Tips:

• A hot mounting resin is used as the mounting resin. 
• Open the seal for prevention measure of deposition of resin waste. 
• Adjust the hydraulic pressure to prevent over pressure. 
• Attached the heater cover as soon as possible.

Fast, accurate resin-filled molding is performed by automatic injection of a liquid resin (two-liquid mixture) into a molding die in which a test piece is set.

Features:

• Accurate cutoff-injection of a two-liquid mixture (containing proportion-controlled amounts of a base resin and a curing agent that are stirred together uniformly).
• Cutoff-injection amounts of the two-liquid mixture can be controlled by performing volume calculation of the test pieces on an electronic balance.
• Identity management is possible.
• Cut-off injection can be performed in a short time (within 5 minutes/specimen).
• The molding die size can be changed.
• The curing time can be shortened by addition of an insulating cover.

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